Winbond Places $11 Million Order with ESI for Memory Yield Improvement Systems
March 15, 2000 04:15 PM
PORTLAND, Ore., March 15 /PRNewswire/ -- Electro Scientific Industries, Inc. ESIO announced an $11 million, multiple-unit order for its Model 9350 Memory Yield Improvement Systems from Winbond Electronics in Taiwan. The order began shipping in February and will be completed over the next six months.
(Photo: newscom.com )
"ESI systems have repeatedly surpassed both our expectations and the performance of other competitors," said Eric Chang, Winbond's resources department manager. "With ESI, we continue to experience superior machine performance, higher output and better yield."
The Model 9350 systems, being installed at Winbond's Test Line Four facility in Hsinchu, Taiwan, will be used to increase capacity for production of 64Mb and 256Mb DRAMs.
"This order marks ESI's largest shipment for memory yield improvement systems to Taiwan -- a region that is becoming increasingly significant in advanced DRAM manufacturing," said Keith Taft, ESI's General Manager of Memory Yield Improvement Products. "I am pleased that Winbond continues to select ESI as its supplier of choice."
This press release may include forward-looking statements, which are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such statements are subject to a number of known and unknown risks and uncertainties that could cause actual results to be materially different, either better or worse, from those discussed. Such risks and uncertainties are numerous and are discussed in more detail in the Company's Annual Report on Form 10-K and interim reports on Form 10-Q and include: the continuing strength of the electronics industry -- which is dependent on many factors including component prices, global economic strength and overall demand for electronic devices used in wireless telecommunications equipment, automotive and consumer electronics and computers (such as miniature capacitors, semiconductor memory devices, and advanced electronic packages); the ability of the Company to respond quickly to customer requirements; the ability of the Company to develop and manufacture new products and enhancements, and to introduce them successfully into the market; and the Company's ability to create and sustain intellectual property protection around its products.
About Winbond Electronics Corporation
Winbond Electronics Corporation was established in 1987 in the Hsinchu Science-based industrial park in Taiwan. After 10 years, Winbond has grown to provide turnkey solutions from product design, production, marketing and system development. The company currently has more than 3,000 employees, including overseas branches. Its eight main products are foundry services and integrated circuits for memory applications, data communication, microcontrollers, multimedia, personal computers, speech, telephony and visual communications. Winbond's web site address is winbond.com.
About ESI
Electro Scientific Industries Inc., headquartered in Portland, Oregon, designs and manufactures sophisticated products used around the world in electronics manufacturing including: laser manufacturing systems for semiconductor yield improvement; production and test equipment for the manufacture of surface mount ceramic capacitors; laser trim systems for precise electrical tuning of circuits; precision laser and mechanical drilling systems for electronic interconnection; and machine vision systems. Electro Scientific Industries is traded on the Nasdaq National Market System under the symbol "ESIO." ESI's web site is esi.com.
SOURCE Electro Scientific Industries Inc.
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