Hopefully, this will stir some positive interest tomorrow.
SpeedFam-IPEC Receives Order for Next-Generation CMP System; Leading U.S. IC<p>Manufacturer to Act as Beta Site
CHANDLER, Ariz., Mar 16, 2000 (BUSINESS WIRE) -- SpeedFam-IPEC, Inc.
(Nasdaq:SFAM), a leading global supplier of high-throughput chemical mechanical
planarization (CMP) systems with the world's largest installed base for the
semiconductor industry, today announced it received an order for its
next-generation orbital CMP polishing system from a leading semiconductor
manufacturer in the United States. This manufacturer will act as the beta site
for the system, which is slated for introduction later this year. The system
will be used to manufacture ASIC products at the 0.18-micron design rule and
will support both oxide and metal planarization process applications.
The customer's decision to incorporate tools with greater flexibility and higher
productivity prompted a multi-supplier evaluation that considered process
capability, cost of ownership and total customer satisfaction. SpeedFam-IPEC's
next-generation system was selected as the tool-of-choice overall.
"Our next-generation products are being designed to meet our customers' rapidly
changing process needs," stated Richard J. Faubert, president and chief
executive officer of SpeedFam-IPEC. "This latest addition to our product line
combines our field-proven orbital and rotational CMP technologies into a single
platform. This first beta system is scheduled to ship next quarter with
additional installations targeted at key customer sites in the second half of
2000."
According to Greg Shepard, senior vice president of marketing at SpeedFam-IPEC,
changing market requirements are driving the need for CMP platforms that exhibit
superior flexibility and multi-recipe management with higher productivity. "As
our customers move to smaller device geometries, we are committed to providing
the maximum productivity capabilities and continually evolving our polishing
systems to meet the demands of our global customers."
The next-generation CMP system incorporates an advanced wafer carrier design,
significantly enhanced polishing platen, increased reliability and improved
cleaning capabilities that will continue to lower cost of ownership. The system
also offers robust endpoint and process metrology capabilities superior to those
currently available on the market, as well as being fully integrated with
SpeedFam-IPEC's latest cleaning system that handles multiple interconnect
processes including copper and tungsten.
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a leading global supplier of chemical mechanical
planarization (CMP) systems featuring the world's largest installed base. These
systems are used in the fabrication of next-generation integrated circuits. The
company also manufactures leading high-throughput precision surface processing
systems for the thin film memory disk media, silicon wafer and general
industrial applications markets. In addition, the company markets and
distributes parts and consumables (slurry polishing liquids) for use in surface
processing. SpeedFam-IPEC, Inc. owns a 50-percent interest in a joint venture,
SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture).
This news release contains forward-looking statements. Actual results may vary.
Orders in backlog may not result in future revenue if customers cancel or
reschedule orders. The CMP market may not grow. In particular, the growth of the
CMP market in Asia is uncertain. We may not be able to maintain or increase our
share of the CMP market due to many factors. We may not be able to achieve the
high levels of customer satisfaction to obtain repeat business from existing
customers. We may not be successful in our efforts to develop new accounts.
Competitive conditions in the industry and technological changes may affect the
CMP equipment market. The markets for metal and oxide applications requiring
line widths of 0.18 microns and below, and for copper and 300 mm process
technologies, may not develop, or we may not be successful in developing these
technologies, delivering to market products based on these technologies or
generating revenue from these products. See SpeedFam-IPEC's, SpeedFam and IPEC's
filings with the SEC, the Annual Report on Form 10-K filed on August 30, 1999;
and the Quarterly Report on Form 10-Q filed on January 14, 2000, for additional
risks affecting the company.
Distributed via COMTEX.
Copyright (C) 2000 Business Wire. All rights reserved. |
