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Politics : Formerly About Applied Materials
AMAT 270.03+0.8%10:31 AM EST
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To: Proud_Infidel who wrote (34610)3/21/2000 4:49:00 PM
From: Proud_Infidel  Read Replies (2) of 70976
 
TSMC Launches 0.15-Micron Process
March 21, 2000 (TAIPEI) -- Taiwan Semiconductor Manufacturing Co., Ltd. announced the launch of its 0.15 micron process, the first time that process has been used by Taiwan's foundry industry.




With yields comparable to the current 0.18-micron process technology, TSMC will deliver 0.15-micron wafers first to four IC designers, including leading PLD producer Altera, and is expecting a noticeable increase in the number of customers in the third quarter.

The 0.15-micron process was qualified at TSMC's third fab, and will be deployed in three additional wafer fabs by the end of 2001. It will include baseline, low voltage and low power processes. TSMC will start with the baseline and low voltage processes, and develop low power processes in the third quarter of 2000.

The new generation 0.15-micron process will enable dies to be produced 26 percent smaller than in the 0.18-micron process, and will give a 25-30 percent better performance than TSMC's current leading 0.18-micron process technology.

TSMC's move brings it closer to its arch-rival Intel Corp., which has already adopted the 0.15-micron process and is expected to move into 0.13-micron manufacturing some time next year. Some observers believe that Taiwan's foundry industry now has a real chance of overtaking Intel.

(Commercial Times, Taiwan)
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