Microsoft, TI target Windows CE support for DSP chips
By J. Robert Lineback
Semiconductor Business News
(03/22/00, 07:45:15 AM EDT)
REDMOND, Wash. -- Microsoft Corp. here today announced plans to work Texas Instruments Inc. to support the use of TI's digital signal processors in Windows CE applications and embedded systems development. The collaboration is expected to expand the use of DSPs in Internet appliances, portable systems, and a range of embedded designs for consumer and business applications.
"This agreement brings Windows CE capability to the DSP or DSP capabilities to Windows CE--whichever way you look at it," said Randy Ostler, marketing manager for mobile computing at TI in Dallas. "Microsoft [and its Windows environment] can bring millions of software developers to TI DSPs."
Early demonstrations of development tools for Windows CE on TI's DSPs are expected within the next several months. "Products are not being announced today, but I think there are sufficient efforts to get system out to developers quickly," Ostler added.
A key initial objective in the effort is to allow Windows CE developers the ability to directly target TI's Open Multimedia Application Platform. This platform is based on the recently introduced TMS320C55x DSP architecture (see Feb. 22 story) and aimed at portable systems, such as third-generation (3G) cellular phones with Internet access, voice, data and video capabilities.
"The Windows CE platform currently supports multiple microprocessor architectures, allowing it to be the ideal solution for a wide range of products," said Bill Veghte, vice president of embedded development at Microsoft. "However, as new Internet appliances and embedded solutions require new levels of performance, low power, and real-time connectivity, systems and applications designers need to utilize advanced digital signal processing engines."
The Windows CE programming systems for TI DSPs will be made sold by Microsoft to developers. |
