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Technology Stocks : Dell Technologies Inc.

DELL 133.78

-0.1%

Nov 14 9:30 AM EST

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To: kemble s. matter who wrote (155874)	4/3/2000 12:43:00 PM
From: rudedog	Read Replies (1) of 176387

Kemble - Copper interconnects are lower resistance than Aluminum - so chips can be run faster with less heat. Getting heat out of the chip is the biggest limitation on current speed of processors. SOI (silicon on insulator) allows smaller geometries, which contributes to better performance and allows more stuff on a given size of silicon. Intel, AMD, Samsung and others are moving to copper for their next generation (.13 Micron) processors - it's pretty much a requirement to go beyond 1 GHz without special cooling technology. IBM has been pushing SOI for specialized applications, but there seems little reason to drive that hard into desktop chips any time soon - i.e. not for years. It will probably be used first in server chips, where the increased density would allow large on-chip cache and other performance enhancements. None of this stuff applies to DELL - DELL is not in the semiconductor business, does not do any custom chips, and does not have either the business justification or engineering talent to go in that direction.

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