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Technology Stocks : Trikon Technologies - TRKN

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To: bob zagorin who wrote (888)4/3/2000 12:43:00 PM
From: bob zagorin   of 926
 
CEO of Dow Chem on CNBD this a.m. talking about "low-fill". I believe he is referencing this partnership with IBM as posted on RB earlier

"...IBM targets low-k

Next on IBM's ambitious copper technology roadmap is switching to low-k dielectric films,
replacing the silicon-dioxide insulators now employed in the company's dual-damascene processes.
"We have an impressive low-k roadmap, but I cannot talk about it now," says Lange. He did hint
that the next-generation dielectric will not be fluorinated silicon glass (FSG) or any other doped
versions of silicon-dioxide, which are being used by other chip makers to lower dielectric constants
slightly from the 4.1 level of SiO2.

IBM plans to introduce a series of low-k materials to serve as next-generation insulators and get
around the capacitance problems in interconnects. The first one will be disclosed later this year. "We
believe we will be in the leadership [of low-k dielectrics], just like copper," says a confident Lange.
"We didn't show the industry what we were doing in copper until we were ready to start aggressively
using it," he notes, referring to IBM's surprise technology announcement in 1997 which sparked the
industry's copper rush (see coverage from SBN's magazine, October 1997)..."

check TRKN's 10-K as posted earlier to see how strong their product line is in relation to low-K in this area.
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