Mattson--the transformation Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Mattson--the transformation

Public Reply Prvt Reply Mark as Last Read File

Next 10PreviousNext

To: lrrp who wrote ()	4/6/2000 4:09:00 PM
From: lrrp	Read Replies (1) of 4

RE: new order for cvd is a 200mm system described below "The Aspen II CVD system deposits silane-based films such as oxide, oxynitride and nitride, as well as TEOS-based oxide films. Mattson offers a full suite of PECVD applications: ARC layers for excellent CD control; etch stop layers for use with low k materials; passivation layers; IMD underlayers, low temperature capping layers; and low k FSG layers. The system can be configured with one or two multi-station process chambers. Each chamber can process four wafers at a time, providing extremely high throughput without sacrificing process performance. Mattson's plasma enhanced chemical vapor deposition (PECVD) technology allows the system to process wafers at the relatively low temperature of 400 degrees Celsius or less, required for processing after aluminum metallization layers are deposited. Film stress and density can be controlled independent of process chemistry by the use of a low frequency radio frequency bias." ------------------------------------------------------------------------------------------------------------------------ SPECS for ASPEN III "The Aspen III CVD system is based on the Aspen III platform and can be configured with one, two or three process chambers, where each chamber can process two wafers at a time. The Aspen III CVD system deposits dielectric film and silane-based films and we offer a full suite of plasma enhanced chemical vapor deposition applications. Depending on the type of film deposited, the Aspen III CVD has the capability to process up to 180 wafers per hour, affording a cost of ownership advantage not found on competitive systems. The Aspen III CVD features a small volume chamber design that allows shortened automatic clean times for increased system availability and uptime. The smaller chamber also permits higher deposition rates. The resulting higher throughput permits the use of slower, more consistent and less damaging process technologies than are economically feasible in conventional single wafer systems. Our plasma enhanced chemical vapor deposition technology allows the system to process wafers at the relatively low temperature of 400 degrees Celsius or less, required for processing after aluminum metallization layers are deposited on the wafer. Film stress and density can be controlled independent of process chemistry by the use of a low frequency radio frequency bias. Our dual loadlocks isolate the process chamber from pressure and temperature fluctuations. This isolation of the process chamber reduces particulates and improves film quality and repeatability. The Aspen III CVD system is one of the first chemical vapor deposition bridge systems in the industry that is capable of handling both 200 millimeter and 300 millimeter wafer production with minor modifications to the platform. Other 200 millimeter systems cannot convert to 300 millimeter production, or may require completely new process chambers to convert to 300 millimeter production. The flexible system design addresses the needs of large volume manufacturing where cost is a major consideration. Aspen III CVD has one of the smallest footprints available in 200 and 300 millimeter plasma enhanced chemical vapor deposition tools and provides a throughput advantage for selected thin film applications. " ------------------------------------------------------------------------------------------------------------------------ HELP! MY question is why the order was for this model vs. Aspen III which can be used as a bridge tool for both 200 and 300: ?

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Next 10PreviousNext