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Technology Stocks : General Lithography

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To: Jim Oravetz who wrote (1215)4/21/2000 4:34:00 PM
From: Artslaw   of 1305
 
I was actually at IRPS and saw Lucent's paper (among others). You should realize that this paper is talking about the reliability of the oxides--how long they will last--not necessarily the practicality (nor the manufacturability). What they do not address is that the gate leaks like a sieve, which makes design difficult because (1) it makes simulation more difficult and (2) the power goes way up, even with reduced power supplies. Don't get me wrong--these devices will quite likely be used in the future, but the point is that reliability might not be the ultimate limiter of device scaling.

On the other hand, there are tricks (like dual-gate devices) which allow you to use thicker oxides and still get the current gain (= faster devices) that you'd get from another generation of oxide thinning, thus also pushing out the "brick wall." I think Moore will be OK for a few more years. . .Or at least my options are banking on it.

Steve
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