Hi all; I found no new links to articles giving costs per pin. Like I said, the packaging industry moves kind of slow. But I did collect up some links of general interest in the subject of packaging (and since RDRAM is basically a way of reducing pins per package, while maintaining high bandwidth, this should be of some interest):
Intel Plans Next-Generation Chip Packaging
Intel will introduce its 64-bit Itanium microprocessor this year in a multichip-module (MCM) package and move to a radically new package for next-generation Willamette, Foster, and McKinley processors, according to industry sources.
techweb.com
Packages fill SOC design gaps
According to Dataquest Inc., San Jose, the market for multichip packages will grow rapidly, driven by issues of time-to-market and cost. Within four to five years, MCMs may grow to represent 10% of all IC packages, said Dataquest analyst Jim Walker.
techweb.com
Japan cranks up its packaging research
Stepping into the breach is the emerging system-in-package approach, which maintains discrete components by using high-speed interconnect and advanced packaging techniques to create a virtual SoC in a package. Amkor Technology, for example, has done designs for customers that combine passives and gallium arsenide circuits in a single package, cutting costs.
...
In 3-D packaging, ASET aims to develop a package that can stack at least five chips. Each chip will have through holes less than 10 microns in diameter made in less than a 20-micron pitch. The dice could be shaved as fine as 50 microns using new grinding techniques.
techweb.com
Why Chip packaging's a hot topic for OEMs
- A multichip "system-in-a-package" has been launched as an interim step toward monolithic system-on-a-chip ICs. Instead of embedding different core functions on a single chip, Amkor assembles separate active-function chips, along with 20 to 30 passive components, in a single BGA package as small as 22 mm x 22 mm.
techweb.com
Also of interest:
Getting Ready For The Race
techweb.com
Tessera expands beyond BGA
techweb.com
Alpha wins Ericsson MCM contract
techweb.com
S3 eschews embedded DRAM for MCMs
techweb.com
-- Carl |
