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Politics : Formerly About Advanced Micro Devices

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To: Joe NYC who wrote (108328)4/28/2000 4:59:00 PM
From: Scot  Read Replies (1) of 1570889
 
One thing I am wondering about Socket A and Socket 370 FlipChip packaging, looking at the picture, it appears that the contact area for the heatsink is limited to the area of the chip itself. Wouldn't it be advisable to make the contact area larger?

It does seem small. I'm not a thermal-dynamics engineer....so I can't say. I wonder if this has something to the cache? I.e., on the slot packaging, the cache is similarly separate.

All I can say is that this puppy is going to fly. I'm glad they're sold out, because Duron is going to blow away the current Athlon. I can hardly wait for T-Bird!

-Scot
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