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Technology Stocks : WDC/Sandisk Corporation
WDC 158.52-4.6%10:47 AM EST

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To: Ausdauer who wrote (11005)5/12/2000 4:44:00 PM
From: Zeev Hed  Read Replies (3) of 60323
 
Aus, a decrease of features from .28 microns to .24 microns should increase the dice count per wafer by 36%. This is a first approximation (assuming all dimensions are decreased by the same amount). The calculation is quite simple it is the square of the ratio of the two "features size" (.28/.24)^2. In practice it is a little less than that since some dimensions cannot be decreased proportionally unless the writing voltages are decreased as well. On the other hand, smaller devices also result in a higher percentage of the circular wafer to be utilized. A safe assumption is 10% less than "theoretical" or about a 32% increase in dice per wafer.

Zeev
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