Nokia, Ericy use Texas Instruments Platform and DSP Chips
For complete story see: ti.com
Texas Instruments Leadership DSP Cores to Serve as the Heart of the Third Generation Wireless World
The world's insatiable appetite for wireless connectivity during the past decade has supplanted the personal computer as the fastest growing and most pervasive form of personal technology.
Forecasts predict that by 2002, more than one billion global subscribers will benefit from wireless devices, which utilize rich streams of data to enable a wealth of new user applications and consumer services such as wireless e-commerce, real-time video phones and global location services (GPS).
This evolution in wireless technology from voice-only service known as second generation wireless (2G), to advanced data-centric third generation (3G) functionality, is made possible by the power and performance that only Texas Instruments' world leading Digital Signal Processors (DSP) can deliver.
As the world leader in DSP solutions for the wireless industry, Texas Instruments (TI) is extending its position in 3G wireless with the announcement of the new TMS320C64x? and TMS320C55x? DSP cores. Today, TI is leveraging its in-depth DSP and analog technologies, as well as its extensive system level integration expertise, to create new solutions to drive the growth of next generation wireless handsets and infrastructures.
With the addition of TI's new DSP core technologies, TI will allow wireless equipment manufacturers to offer differentiated products faster to the market while providing enhanced services and convenience to wireless end users.
TI C55x DSP Core Technology Delivers Power and Performance for Wireless Handsets
For advanced, 3G wireless handsets and mobile computing devices, a highly-optimized solution using TI's new C55x DSP core will deliver the power and performance needed by leading wireless equipment manufacturers and service providers.
The C55x DSP core provides for frequencies up to 400 Megahertz (MHz), delivering the raw processing power needed to bring graphics-intensive Internet applications, digital still imaging and digital audio, as well as real-time video conferencing to wireless handsets, in form factors no bigger than phones used today.
In fact, the TI's C55x DSP core, combined with TI's leading integration capabilities, will help to enable smaller, lighter-weight devices, with additional functionality.
The C55x DSP core not only exceeds the processing requirements for 3G data applications and services, but extends the battery life used in wireless handsets by reducing power consumption six times lower than the industry leading, code-compatible TMS320C54x? DSPs . The C55x DSP core delivers ultra-low power consumption of 0.05 milliWatts per Million Instructions per Second (MIPS).
As a result, the C55x DSP core will extend battery life in 3G handsets, allowing wireless end users to take advantage of advanced functionality and data services, without surrendering wireless convenience and portability.
In next generation voice-only handsets, the C55x DSP core will enable a phone's battery life to operate at least a half-day to one week longer than today's leading C54x DSP-driven devices.
TI's new C55x DSP core will drive the first platform for 3G wireless handsets. TI's DSP-based Open Multimedia Application Platform will enable next generation wireless Internet handsets, communicators and advanced mobile computing devices. This platform, utilizing TI's C55x DSP technology, will enable advanced wireless Internet access and applications, including future voice, data and video functions. TI's Open Multimedia Application Platform will deliver the advanced processing required to make these functions a reality, without compromising the power efficiency essential to wireless communications devices
Leading worldwide wireless manufacturers Nokia and Ericsson have already committed publicly to using TI's Open Multimedia Application Platform, incorporating the C55x DSP core for its 3G wireless handsets and information devices.
"TI's C54x DSP family is a recognized success in the wireless communications industry," said Y. Neuvo, SVP of Product Creation, Nokia Mobile Phones. "With the breakthrough power efficiency and leading-edge performance of the C55x DSP announced today, TI is extending its leadership in the competitive industry."
TI C64x DSP Core Provides Processing Power to Exceed Wireless Infrastructure Demands
In the same way that wireless handset growth is expected to explode as a result of the evolution to 3G wireless, so will the demand for powerful wireless infrastructures to maintain new levels of user connectivity. TI's next generation C64x DSP core is ideal for the needs of wireless infrastructure manufacturers, delivering the highest performance DSPs in the world, with speeds of up to 1.1 GigaHertz (GHz) and performance near 9,000 MIPS.
With initial devices running at frequencies of 600 to 800 MHz, wireless infrastructure designers enjoy speeds comparable to 10 times the DSP performance of the current industry leader, the code-compatible TMS320C62x? DSPs
Ten of the top 13 leading wireless infrastructure manufacturers are designing their 3G basestations using TI's leading DSP technology.
"With the C64x and C55x DSP cores announced today, TI is providing Ericsson with the processing power to create breakthrough products for the new telecommunications world," said Gosta Lemne, Vice President, Ericsson Corporate Function Technology, Access Technology Management. "The addition of the C64x DSP core to the C6000 road map provides the extreme performance needed for WCDMA radio base stations." |
