This post from Sjaym at RB describes the brass boards apparently being used to rollout 3G in Japan. Note how it contrasts with the Nokia/IDCC/CoWare design process methodology described in Posytle's post.
Clarence - Re: Brass Boards in Rollout of 3G in Japan
In your post ASM conversation with our new CEO MG, relative to the rollout of 3G products you noted:................
Specifically, Mark's story was that initial Japanese products will work off of what they refer to as "brass boards."
It now makes sense (to me) as to why, and how, 3G in Japan can be rolled-out in such a short time......... 2001.
"Brass board" methodology was used in my former place of employment to assist in the development of newly designed electronic systems. As I recall, these new but unproven systems would be subjected to rigorous, long term testing regimes to evaluate the hardware implementation of the on-paper technology. Generally, the majority of the associated developmental stage hardware was in circuit board form. During the many months(even years) of rigorous "real world" evaluations and tests, unsatisfactory results dictated that component(s) and/or point-to-point connections on prototype circuit boards had to be modified and/or rerouted. These boards (known as "brass boards") were modified in the field or sent back to the lab. Modified interconnections were either etched-in or "haywired" as required. Believe it or not, haywiring was simply a modification using plain, ole copper wires!! Crude as haywiring was , it served its purpose.......saved time and very economical. If the revised connection(s) proved-out, a burned-in, "official", fully documented version would be issued and installed. Testing and evaluation would continue on the cleaned-up board. Eventually (after many tedious iterations) a system would be proven to be satisfactory when its functionality was "repeatable" and reliable over all known environmental scenarios. Then and only then would upper management even think about transferring this "brass board" technology into a system on a chip.
It seems to me that even if the Japanese are successful and roll out their system in 2001, they will still need to transfer their "brass board" technology onto a chip (no easy task).
Looks like a perfect spot for IDCC to step in and help them to make that transition.
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