MORE NEW RAMBUS PRODUCTION - Monthly production
volume is targeted for 500,000 RIMM modules by year
6/05/00 - High Connection Density Adds to Power House Executive Management Team
SUNNYVALE, Calif., Jun 5, 2000 (BUSINESS WIRE) -- High Connection Density, Inc. (HCD), designer and manufacturer of custom,
high-performance PC boards and inventor of high-frequency, high-density connector technology, recently added two more power
houses to its already strong executive management team.
Dr. Jean-Luc Pelissier, Ph.D. was recently named President of HCD based in HCD's new Silicon Valley Headquarters in Sunnyvale,
California. Previously Vice President and General Manager of Schlumberger's Advanced Business Engineering Resources (SABER)
Business Unit based , Jean-Luc Pelissier brings to HCD over 15 years of high-tech experience in factory management, developing and
marketing semiconductor equipment, and, while at SABER, pioneering the manufacturing and engineering service business in the
semiconductor industry. As President of HCD, Dr. Pelissier will be responsible for businesses and operations including HCD's Rambus
memory module business, high frequency PCB design-to-production services and any business relating to HCD's proprietary
high-frequency LGA connector technology called SuperButton(TM).
"The huge industry enabling potential of HCD's design and interconnect technology and the high caliber of people are what excite me
most about this company. My experiences in factory management, semiconductor manufacturing and engineering services leverages
significantly into HCD's design, validation and manufacturing services which we offer to manufacturers of high-end computers,
consumer electronic applicance and communication devices," said Dr. Pelissier.
Dr. Dyi-Chung Hu, Ph.D., was formally appointed by HCD to the position of Executive Vice President as of June 1, 2000. Dr. Hu
comes to HCD from Hannstar where he served as Vice President for the Technology Center. Having earned his Ph.D. in Materials
Science at M.I.T., Dr. Hu worked at ITRI specializing in IC packaging and TFT-LCD flat panel displays. Dr. Hu also served as R&D
Program Manager at IBM in Fishkill, N.J. before returning to Taiwan to be a professor at the NCTU. Before joining Hannstar in 1998, Dr.
Hu was with Prime View, Inc. reaching the position of EVP. In his new position at HCD, Dr. Hu will be responsible for the overall
operation, in cooperation with the US Headquarters, to provide manufacturing, distribution and global logistics of products and services
for semiconductor industry giants and computer systems companies worldwide.
"Through careful planning and precise execution of building HCD's world-class manufacturing infrastructure, HCD now has two
production lines in operation with production capacity for 250,000 memory modules per month. Our focus is on high-quality, thus full
testing is performed on all manufactured products using high-speed, high-accuracy automated test systems. Monthly production
volume is targeted for 500,000 RIMM modules by year end. We are completely ready for the Rambus RIMM market," said Dr. Hu.
Other members of the HCD executive team include Dr. Che-Yu Li, CEO former director of the Electronic Packaging Program and
Chairman of Materials Science and Engineering at Cornell University with over 30 years in electronic packaging. Dr. Charles Steidel,
COO, was Director of packaging at Intel and also has over 30 years in electronic packaging. Dr. Dirk Brown, Executive Vice President
managed R&D programs at AMD, Sunnyvale and has a Ph.D. in Material Science from Cornell University and an M.B.A. from San
Jose State University.
Having recently joined the growing list of Rambus partners, HCD is ready to launch a complete line of Rambus 128/144Mb RDRAM
products from 4D to 32D RIMMs. In addition, leveraging 30 years of high-speed board design and a proprietary high-speed LGA
interconnect technology called SuperButton, HCD offers a revolutionary small-form-factor RIMM that has twice the propagation delay
performance with 30% cost reduction and 50% space reduction versus current designs. Designs for the Rambus 256/288Mb RIMMs
are already complete and HCD is ready to manufacture in high volume.
To see a presentation of HCD's 32D RIMM module, and a demonstration of HCD's standard design RIMM module with Intel's 820
Chipset at Computex Taipei 2000, please visit HCD at CMC booth in the Taipei World Trade Center venue Area A.
About High Connection Density, Inc.
High Connection Density, Inc. offers high-speed PCB design, verification and world-class manufacturing services providing quick,
turn-key solutions to the high-end computer, consumer electronics and communication industry worldwide.
(LGA) superimposer technology, SuperButton, provides a minimum inductance, low-contact force, high pincount connector solution at
low cost. For more information on HCD's innovative high-density SuperButton connector technology and, high-performance RIMM and
SORIMM modules, please contact Angela Martin, at High Connection Density, Inc. 408/743-9700 Ext. 306
CONTACT: High Connection Density, Inc. Angela Martin, 408/743-9700 Ext. 306 marcom@hcd21.com
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