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Technology Stocks : Intel Corporation (INTC)
INTC 34.69+1.1%2:28 PM EST

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To: Bilow who wrote (104249)6/8/2000 11:12:00 PM
From: jim kelley  Read Replies (1) of 186894
 
Carl,

Your RIMM and DIMM trace width calculations are too high.
(Gaps and isolation grounds are for the inner traces not the outer ones and you are counting them for every signal.)

But no matter, there does not seem to be a problem making RIMMs or DIMMS. The impedance tolerances are +-10%.

I notice that the 820 MOBO is specified as a 4 layer board.
The location of the RIMM modules is limited by the maximum length of the transmission line. This places the RIMMs near the memory controller. So there should be no problem connecting the memory with the memory controller as far as the trace connections are concerned.

This has nothing much to do with making money on the stock. <G>

:)
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