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Technology Stocks : Intel Corporation (INTC)

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To: jim kelley who wrote (104265)	6/9/2000 12:24:00 AM
From: Bilow	Read Replies (1) of 186894

Hi jim kelley; Re: "Your RIMM and DIMM trace width calculations are too high. (Gaps and isolation grounds are for the inner traces not the outer ones and you are counting them for every signal.)" My calculations were not for the RIMM/DIMM, they were for the motherboard. RIMMs and DIMMs have their own set of issues. One of the reasons for making my calculations is to get an idea of how the two competing technologies will scale to a RIMM / DIMM replacement that involves a wider bus. It will be interesting to see what the RDRAM-II spec calls out for the new interface. The higher frequencies involved are probably going to require even more space between signals. With engineering, there aren't any easy answers, just tradeoffs. But most engineers are unaware of the nature of all the disadvantages of RDRAM. (I'm working on that... :) -- Carl

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