I do not disagree with you but still stand firm on the throughput issue. Direct write is the method of exposure used to write masks and reticles. It is a fantastic technology with fantastic potential. However, the high cost of reticles and masks is directly proportional to the cost and throughput of the direct write systems.
We will eventually get to direct write lithography for mass production but not for a number of years. When you are talking about 0.10um feature sizes, the direct write beam cannot be bigger than 0.10um in diameter. An 8" wafer has an area of roughly 50cm2 or 5,000,000,000um2. That's 5 billion square microns.
I have to run off to pick up my son but do the math. The beam is roughly 0.008um2 in area. Someone needs to figure out how fast the beam needs to be to give this direct write system a throughput close to a step and scan or stepper that is currently in production.
Point is, they are slow but excellent for prototyping devices. When it comes to producing on a large scale, conventional lithography will win out for more years than the stock market is willing to look at for placing a market value for the company. It is coming but not in this market lifetime. your investments in ASMLF, UTEK, MASK, PLAB, and DPMI are safe for a number of years.
Andrew |
