SpeedFam-IPEC's Next-Generation, Universal CMP System Enables Improved Yield and Provides Low Cost of Ownership
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Wednesday July 5, 8:31 am Eastern Time
Company Press Release
SpeedFam-IPEC's Next-Generation, Universal CMP System Enables Improved Yield and Provides Low Cost of Ownership
Momentum(TM) Integrates State-of-the-Art Metrology and Carrier Technology with New Planarization Technique to Provide Highly Flexible Approach to CMP, Down to 0.13 Micron
CHANDLER, Ariz.--(BUSINESS WIRE)--July 5, 2000-- SpeedFam-IPEC Inc. (Nasdaq:SFAM - news), a leading global supplier of high-throughput chemical mechanical planarization (CMP) systems for the semiconductor industry, with the world's largest installed base, today unveiled Momentum(TM) -- its new, advanced CMP system.
This highly flexible tool features a new polishing system that combines SpeedFam-IPEC's industry-proven rotational and orbital technologies. Momentum was developed to address the industry's growing need for an advanced level of process capability, continued geometry shrinks down to 0.13 micron and CMP challenges for applications such as copper and shallow-trench isolation (STI) in advanced semiconductor device manufacturing.
SpeedFam-IPEC's President and Chief Executive Officer Richard Faubert said, ``Ever-shrinking geometries and new materials such as copper and low-k dielectrics are the enabling technologies for producing the next-generation, high-performance chips that are fueling the new economy. We have leveraged our more than 10 years of product innovation and technology expertise in CMP to develop a new and revolutionary system that addresses the unique requirements of advanced devices. With an installed base of CMP platforms approaching 1,300 worldwide, and an increasing number in use for advanced applications, the Momentum platform further extends our CMP expertise for today's future-focused chipmakers.''
Meeting the Challenge of Advanced CMP Applications
Momentum, a universal CMP system specifically designed for logic and application-specific integrated circuit (ASIC) applications, is a highly flexible, dry-in/dry-out CMP wafer processing system that fully integrates four independent wafer-polishing platens, cleaning capability, advanced metrology and automation. Momentum enables simultaneous process development and production operation on a single tool, and supports ``hot lot'' processing without significantly impacting scheduled production. The system's highly configurable platform improves productivity and provides low cost of ownership (CoO). Momentum inherently provides chipmakers with an easy transition between oxide, tungsten, STI and copper applications. Its unsurpassed flexibility provides IC manufacturers with the extendibility to utilize the system for tungsten applications today, and seamlessly switch to more advanced metals such as copper, as their technology roadmap progresses.
Dean Freeman, principal analyst at market research firm Dataquest, said, ``The total market for CMP equipment is estimated to reach $2.5 billion in the next five years -- making it one of the strongest growing segments in the semiconductor equipment market. Also, the market for copper CMP tools has been forecasted to grow at a compounded annual growth rate of 38 percent over the next five years -- to more than $230 million by the year 2004.''
New Innovations in CMP Technology
The Momentum system features several breakthroughs for CMP applications. At the heart of the tool is SpeedFam-IPEC's new Next(TM) planarization system, a hybrid of the company's industry-proven rotational and orbital CMP capabilities. This technology synergistically combines the stability of an advanced solid platen with the extraordinary flexibility of orbital system architecture; consistently producing improved process results.
Momentum also utilizes Adaptive Planarization Technology (APT(TM)) -- a new, front-referenced carrier technology that features a unique ``edge-tuning'' design that ensures outstanding within-wafer uniformity. It provides outstanding wafer profile control that compensates for incoming deposition issues and post-polish within-wafer uniformity to class-leading edge exclusion in copper and STI applications. Moreover, Momentum's Sentinel(TM) multi-zone, broadband optical endpoint assures complete copper removal over 100 percent of the wafer surface. It also allows for process recipe adjustments to take full advantage of APT's multi-zone capability.
In addition, SpeedFam-IPEC has developed Intelligent In-line Inspection (i3(TM)), a closed-loop control metrology technology that enables automatic adjustments for pre- and/or post-polish measurement. i3 lowers CoO and is particularly effective for high-mix manufacturing environments.
Momentum is the only system that offers all three advanced components -- Next, APT and i3 -- providing a highly effective, superior process capability at a low CoO. SpeedFam-IPEC's 776 platform can be modified to Momentum's polish configuration. Components can be installed at the customer site with minimal expense and interruption to manufacturing.
Product Availability
SpeedFam-IPEC reports that the first Momentum beta system will ship in Q2 2000 and will be available to ship its first volume production tools in Q3.
About SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. is a leading global supplier of chemical mechanical planarization (CMP) systems used in the fabrication of next-generation semiconductor devices, with the world's largest installed base. The company is also a leading manufacturer of high-throughput precision surface processing systems for the thin film memory disk media, silicon wafer and general industrial applications markets. The company markets and distributes parts used in CMP and precision surface processing. SpeedFam-IPEC, Inc. owns a 50 percent interest in a joint venture, SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture). SpeedFam-IPEC's web site is www.sfamipec.com
This news release contains forward-looking statements. Actual results may vary. The CMP market may not grow. In particular, the growth of the CMP market in Asia is uncertain. We may not be able to maintain or increase our share of the CMP market due to many factors. We may not be able to achieve the high levels of customer satisfaction to obtain repeat business from existing customers. We may not be successful in our efforts to develop new accounts. Competitive conditions in the industry and technological changes may affect the CMP equipment market. The markets for metal and oxide applications requiring line widths of 0.18 micron and below, and for copper and 300 mm process technologies, may not develop, or we may not be successful in developing these technologies, delivering to market products based on these technologies or generating revenue from these products. See SpeedFam-IPEC's, SpeedFam's and IPEC's filings with the SEC, including the Form S-4 filed on February 5, 1999, as amended; the annual report on Form 10-K filed on Aug. 30, 1999; and the Quarterly Report on Form 10-Q filed March 20, 2000, for additional risks affecting the company. |
