Another perspective of AMKOR's product.
Ref:http://www.semiconductoronline.com/content/news/article.asp?DocID={1502913B-4CE7-11D4-8C54-009027DE0829}&Bucket=Technology+News
Amkor prototypes System-in-Package
6/28/2000
By Kathereine Derbyshire
System-on-chip (SOC) designs are attractive at first glance, but
difficult to execute. They squeeze a handful if ICs and passive
components onto a single die, reducing board footprint and total
manufacturing cost. Yet many of the most commonly cited
applications for SOC use a wide range of process technologies. For
example, wireless applications are likely to require bipolar silicon or
even GaAs circuitry in addition to logic and memory. Combining such
disparate processes on a single chip can eliminate many of the cost
benefits of integration. Tying IP blocks together is a challenging
design task as well. Only a few vendors can muster the necessary
design and process expertise.
For the rest, system-in-package (SiP) designs offer many of the
same advantages. Like SOC, SiP designs can be treated as a single
functional block, ready to drop in to the overall system. Instead of a
single chip, though, an SiP contains individual IC and passive
components, bonded to a laminate substrate. SiP differs from
multichip modules and hybrids because it relies on inexpensive
plastic laminates and standard bonding and die attach methods.
Patrick McKinney, senior VP of business development for Amkor
Technology's Modules Group (Chandler, AZ, USA), explained that
development of SiP modules requires close coordination between
chip design, package design, and test development. For example,
both the chip and package designs must minimize parasitic effects
due to antennas and coils. Moreover, the finished design must meet
both performance and manufacturability requirements.
Amkor's recently opened package prototype line allows the company
to develop functional, manufacturable package designs in
collaboration with the customer. Since Amkor's main SiP
manufacturing facility is in the Philippines, having a prototype line
and design staff in the United States reduces turnaround time.
The line can handle both flip chip and wirebond assembly processes.
McKinney told Semiconductor Online that Amkor is currently working
on prototypes with five or six customers. The line is processing six to
eight lots per week, leaving lots of equipment time free for additional
projects. |
