Canon, Ultratech announce 300-mm litho tools prior to Semicon West
By Jack Robertson, Semiconductor Business News
Jul 5, 2000 (12:55 PM)
URL: semibiznews.com
SAN JOSE -- Photolithography suppliers Canon Inc. and Ultratech Stepper Inc. today announced 300-mm exposure tools which will be unveiled at the Semicon West trade show in San Francisco next week. The tools are aimed at the early efforts of chip makers to migrate production from 200-mm to 300-mm diameter substrates.
Canon of Japan will extend its 300-mm platform to offer several lithography tools: a new 0.73-numerical aperture krypton fluoride scanner; a 0.7-n.a. argon fluoride scanner and a 0.54-n.a. i-line stepper. The same exposure tools are also available for 200-mm wafers, and those systems can be modified to handle the larger wafer size in a half-hour by changing the wafer chuck and adjusting handler settings, said Phil Ware, director of technical marketing for Canon USA in San Jose.
"Canon has been making bridge lithography tools since 1998 that can easily converted from 200-mm to 300-mm," Ware explained "The new mix-and-models to be introduced next week extend this capability to new resolution tools."
Canon already has orders for the new systems which will be delivered by the end of the year, he said. Orders placed now would have delivery in the first quarter of 2001. The 248-nm scanner has a list price of about $17 million, the 193-nm tool at $9.5 million and the I-line stepper at $6 million, all in 300-mm configuration.
San Jose-based Ultratech Stepper also announced a new 300-mm wafer version of its wafer bumping tool, called the Saturn Spectrum 300. The system will be shown for the first time at Semicon West next week. A 200-mm version of the wafer bumping system has been on the market for flip-chip packaging. Both wafer size versions have imaging resolution capability down to 2 microns. An automated alignment system allows bumping for most unique features on a wafer, according to Ultratech.
www.cmpnet.com
The Technology Network |
