Monday July 10, 9:00 am Eastern Time
Company Press Release
SOURCE: Silicon Valley Group
SVG Strengthens Lithography Portfolio With Two New High Performance High Throughput Micrascan Products
MSV Very High NA System Targets Critical Applications and MSIV Addresses Sub-Critical Application Needs for 200/300 mm Semiconductor Wafer Production
SAN FRANCISCO, July 10 /PRNewswire/ -- Silicon Valley Group (Nasdaq: SVGI - news) further strengthened its lithography portfolio by announcing two new high performance, high throughput Deep Ultraviolet (DUV) Micrascan lithography systems here on the opening day of the semiconductor chip equipment industry's annual SEMICON West trade show. The Micrascan V, which is the industry's first very high numerical aperture (NA) 193 nm system, addresses chip producers' critical applications needs and the Micrascan IV 248 system targets sub-critical applications. Both new tools have been designed for 200 mm and 300 mm semiconductor wafer production.
The roll out of these new systems reinforces SVG's leadership in lithography by providing its customers with high-volume production solutions that combine the industry's best critical dimension (CD) control with the highest throughput per square foot on the market. The new MSV addresses customer requirements at 100 nanometers, while the new MSIV is a sub-critical tool that now allows SVG to support new and existing customers in all their DUV production requirements.
``These tools address our customers current and future needs,'' said Papken Der Torrossian, chairman and CEO of SVG. ``As the industry moves into next-generation technologies, the MSV will be critical to enabling the production of critical features. It also strengthens our market leadership in continuing to provide the most advanced DUV lithography tools for leading-edge applications. Additionally, by adding the MSIV we are now strategically positioned to offer an unparalleled portfolio of lithography solutions that meet the high-volume 200 or 300 mm production needs of our ASIC and logic customers as well as our DRAM customers worldwide.''
Operated on SVG's flexible cross-performance platform (introduced May 4), semiconductor manufacturers are able to realize the highest productivity without compromising lithographic performance. The new platform enables chipmakers to optimize their throughput in the industry's smallest footprint for both 200 mm and 300 mm wafer production. Besides offering its new platform for 248 and 193 lithography, SVG also plans to offer future 157 lithography products on the new cross-performance platform.
According to John J. Shamaly, president of SVG Lithography Systems, ``The new Micrascan IV allows us to support the industry with SVG's proven CD control superiority and offer a high throughput capability at a very competitive cost of ownership for our customers' non-critical levels. The MSV further demonstrates SVG's continued technological innovation by offering customers the first very high NA 193 nm product that, when operated on our new cross-performance platform, will enable them to realize the best results both in performance and productivity for 200 mm and 300 mm wafer production.''
The MSIV system offers throughput of 160 wafers per hour (WPH) for 200 mm wafer production and 100 WPH for 300 mm production. The MSV tool provides customers with throughputs of up to 150 WPH for 200 mm wafer production and 100 WPH for 300 mm production.
About Silicon Valley Group
Silicon Valley Group is a leading manufacturer of automated wafer processing equipment for the worldwide semiconductor industry. The company designs, manufactures and markets technically sophisticated equipment used in the primary stages of semiconductor manufacturing. Its products include photolithography exposure tools; photoresist processing equipment; oxidation, diffusion and low-pressure chemical vapor deposition processing systems; atmospheric pressure chemical vapor deposition systems and precision optical components and systems. For more information, visit svg.com .
Forward-looking Statement Disclaimer: The matters discussed in this news release, and in particular statements made by the Chairman of SVG and the President of SVG Lithography Systems, include forward-looking statements that involve risks and uncertainties including but not limited to difficulties encountered or the benefits derived from customers using the new cross performance Platform. For a complete review of the risks facing the Company, including economic conditions, industry conditions, trade environment and other risks, reference is made to the Company's filings with the Securities and Exchange Commission. Particular reference is made to the Company's most recent Forms 10-K and 10-Q, which detail such risk factors.
SOURCE: Silicon Valley Group |
