Rudolph adds integrated film metrology tools
for deposition, polishing steps
Semiconductor Business News
(07/10/00, 04:58:35 PM EDT)
SAN FRANCISCO -- During the Semicon West trade show here today, Rudolph
Technologies Inc. rolled out a couple of new real-time, integrated metrology
systems for monitoring and control of opaque and transparent films used in a
variety of wafer-processing applications.
The new i-MP system is aimed at opaque film processing steps while the i-SL tool
is for transparent films.
Rudolph Technologies said the two new systems extend its real-time metrology
technologies for integration with tools that perform deposition and wafer polishing
steps. The two systems are intended to complement the company's stand-alone
metrology systems in production fabs for full characterization of process results.
The i-MP uses Rudolph's Pulse ultrasonic metal film thickness metrology
capability to measure multiple metal film processes. The company said its
non-destructive Pulse technology can monitor single- or multi-layer metal
processes when integrated with tools performing chemical mechanical
planarization (CMP), chemical vapor deposition (CVD), and electrochemical
deposition (ECD) of copper metal.
Rudolph's proprietary laser spectroscopic ellipsometry technology is used in the
i-SL to address real-time integrated metrology of transparent films in processes.
Rudolph said the i-SL tool can be integrated with processing systems used for
advanced gate and gate-stack deposition, low-k dielectric film deposition, and
CMP.
The Flanders, N.J., company predicted that integrated metrology will be crucial in
controlling and characterizing ultra-thin gate dielectrics and advanced high-k gate
materials necessary for next-generation process technologies. "These new
integrated metrology systems monitor key indicators of process integrity and
detect processing shifts in real time, allowing immediate intervention to prevent
losses," stated Paul McLaughlin, chairman and chief executive officer of Rudolph
Technologies.
Software for both integrated tools can automatically flag out-of-spec wafers using
real-time, multi-point measurements, said the company. First shipments of the
i-MP and i-SL systems are planned for early 2001.
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