ESI Introduces Laser uVia Drilling Products for Advanced Packaging And High-Density Interconnect Production
PR Newswire, Wednesday, July 12, 2000 at 15:01
PORTLAND, Ore., July 12 /PRNewswire/ -- Electro Scientific Industries, Inc. (NASDAQ:ESIO) introduced its new line of laser drills for the advanced packaging and High-density Interconnect (HDI) markets. ESI's 5300 product family represents the next-generation of high-accuracy, high-throughput laser drilling systems. These systems create very precise micro-vias, enabling ESI's customers to shrink pad and circuit designs for increased density of the circuit board or package.
(Photo: newscom.com )
The 5300 laser drilling products deliver high accuracy to +/- 10 microns. The systems are equipped with ESI's patented compound beam positioner -- which very quickly and accurately positions the laser for drilling, increasing throughput by fifty percent over earlier models. This product platform also features a new optical bench that will easily accommodate future lasers and optical enhancements.
Showing at SEMICON West in San Jose, Calif.
ESI introduced the first two products in the 5300 family at the SEMICON West tradeshow in San Jose, California. The 5310 Shaped Laser uVia Drill is targeted at very advanced packages -- down to 25 micron diameter vias. The 5310 uses a high-power laser and is capable of drilling vias with a pulse repetition frequency of up to 40 kHz -- doubling throughput over earlier methods. This is achieved by using a technique that "punches" the vias rather than the industry standard trepanning method. The 5310 features a mechanism that shapes the laser beam to create highly circular vias, without damaging the copper at the bottom of the via. These residue-free vias require no additional copper etching steps, and are ready for plating, which increases throughput and decreases manufacturing costs.
ESI's model 5320 Copper Laser uVia Drill is targeted at decreasing costs for copper cutting applications by using a high peak power laser that eliminates the need for pre-etching the copper. This process produces clean, high-aspect ratio vias. This system is targeted at copper cutting for HDI applications -- like mobile telecommunications production.
About ESI
ESI, headquartered in Portland, Oregon, designs and manufactures sophisticated products used around the world in electronics manufacturing including: laser manufacturing systems for semiconductor yield improvement; production and test equipment for the manufacture of surface mount ceramic capacitors; laser trim systems for precise electrical tuning of circuits; precision laser and mechanical drilling systems for electronic interconnect; and machine vision systems. Electro Scientific Industries is traded on the NASDAQ National Market System under the symbol, "ESIO." ESI's web site is esio.com .
SOURCE Electro Scientific Industries, Inc.
-0- 07/12/2000
/CONTACT: investors, Joe Reinhart, 503-671-5500, or media, Kimberly McAlear, 503-671-5233, both of Electro Scientific Industries, Inc./
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/Web site: esio.com |
