Dense-Pac claims to stack different IC products in one unit
Semiconductor Business News
(07/14/00, 04:06:11 PM EDT)
GARDEN GROVE, Calif. -- Dense-Pac Microsystems Inc. here announced it has extended its memory-stacking technology to include multiple devices such as DSPs, ASICs, PLDs, memory and other logic components in a single integrated system chip-set package.
This enhancement of Dense-Pac's LP-Stack technology allows new vertical assembly of dissimilar devices, with different pin counts, pitches, and package sizes for extremely high densities and previously unattainable functionality, according to the company.
Dense-Pack believes the capability to stack differing components can increase functionality and reduce board space. It also believes this will allow device manufactures to reduce their development costs by providing incremental performance enhancements while they develop their next generation of chips.
"This breakthrough will have a great impact on how system designers will approach development," said Ted Bruce, Dense-Pac's president and CEO. "They will no longer be limited to 2-D layouts but will have true 3-D capability."
Key to Dense-Pac's Universal LP-Stack is the patented assembly process that allows the company to reliably stack the various components at high production rates. "We have put in place the processes to handle most any volume," said Bruce.
Through an innovative application of LP-Stack, Dense-Pac's current technology supports all leaded plastic devices. Various functional stacks will be available utilizing the Universal LP-Stack technology.
Dense-Pac is aiming this technology at applications in the booming wireless Internet devices, portable computers, personal digital assistants, cable set top boxes, pagers, cell phones and broadband network and telecommunication switches. |
