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To: tech101 who wrote (779)7/19/2000 11:57:54 AM
From: tech101  Read Replies (1) of 1056
 
ChipPac revenues up 34.7% due to assembly demand for memories, communication ICs

Semiconductor Business News
(07/19/00, 08:15:49 AM EDT)

SANTA CLARA, Calif.--Semiconductor packaging and test contractor ChipPac Inc. today reported a 34.7% increase in revenues to $108.9 million in the second quarter from $80.9 million last year as demand for communications chips and memories for PCs surged. The spinoff from Hyundai Electronics Industries Co. Ltd. said revenues grew 11.8% sequentially from $97.5 million in the first quarter of 2000.

ChipPac posted a net income of $7.3 million in the second quarter vs. earnings of $530,000 in the period last year.

Total chip-packaging unit volume reached 412 million in the second quarter, an increase of 19% over totals in the first quarter, said Santa Clara-based ChipPac. Leaded chip assembly revenue grew 10% sequentially and 41% from the second quarter of 1999, said the company. Laminate product assembly revenue was up 11% from the first quarter and 26% from the second quarter last year.

Revenues from ball-grid array (BGA) packaged ICs grew 45% in the second quarter over the first three months of this year due to higher than expected demand in Rambus DRAMs, synchronous DRAMs, flash memories and devices for wireless communications systems, reported the company.

Chip-testing revenues continued to grow dramatically and were up 34% sequentially from the first quarter, and 221% over the second quarter last year as semiconductor companies opt to outsource more of their test operations (see feature from SBN Online Magazine).
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