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Politics : Formerly About Applied Materials

AMAT 297.57

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3:59 PM EST

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To: Paul V. who wrote (4518)	5/15/1997 1:33:00 AM
From: Kumar Nathan	of 70976

Paul: Good info. All the IC companies are expecting 300mm and are forcing fabs to go in for 300mm process. Moreover .5mu process is almost outdated. Everybody is going towards .35 mu or (if possible).25mu. If you look at the roadmap of every IC designers they will have this. Now the chips are getting smarter and are intended to multiple task with one chip. This resulted in a larger die size. Currently a decent process is around 100-125 sq mm. with 8" wafer you can produce say 50 good dies. Whereas with 12" wafers you can produce more than 80 good dies. This is due to the beauty of (Pie r square{area of cirle}/ die size). Improvement in yield increases the competetiveness of IC companies. Therefore in my opinion, the future is 12" wafer and process will be .35 to .16 mu technology. Regards Kumar.

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