UMC extends 248-nm lithography to 0.15-micron node with ASML mask software
Semiconductor Business News
(08/01/00, 08:36:52 AM EDT)
SANTA CLARA, Calif.--ASML MaskTools Inc. here today announced it has licensed photomask software and sub-wavelength optical technology for 0.15-micron device feature sizes to silicon foundry United Microelectronics Corp. in Taiwan.
UMC said it will use the software and optical extension technology to extend the performance of 248-nm lithography tools. One of the first products using the photomask technology is Xilinx Inc.'s new XCV3200E field programmable gate array, which has over 3 million system gates and is believed to be the largest FPGA available today (see July 31 story).
The agreement expands an 18-month relationship between UMC and the subsidiary of ASM Lithography, which supplied a scattering-bar reticle to the foundry to demonstrate the technology at 0.25- and 0.18-micron design rules. The new licensing pact covers the purchase of ASML MaskTools' MaskRigger software as well as the use of patented scattering-bar technology with any third-party software, according to the companies.
ASML MaskTools said each fab using its scattering-bar intellectual property must obtain a technology license. The Santa Clara-based subsidiary said a license can be obtained either by purchasing the MaskRigger software or by purchasing an unbundled technology license for use with third-party software, such as Mentor Graphics Corp.'s Calibre software. The scattering-bar technology license is sold exclusively by ASML MaskTools.
UMC said it is happy with that arrangement and the sub-wavelength technology from ASML MaskTools. "This licensing agreement meets UMC's production needs for Xilinx's next-generation chips that are built on our 150-nm [0.15-micron] copper-interconnect process and will contain over 200 million transistors and three million system gates," said Peter Huang, lithography department director at UMC. "Process latitude increases significantly with the use of ASML MaskTools' scattering-bar technology, which allows quicker yield maturity of next-generation process technologies."
ASML MaskTools said a key benefit of its technology is the larger process window provided by the scattering bars (sub-resolution design elements placed by MaskRigger software) on the photomask. The scattering bars act as "diffraction matching" elements on standard binary photomasks, which enable the optimization of the total imaging process without the use of expensive alternating phase shift masks, according to the ASML subsidiary.
The software and technology enables fabs to extend the use of installed 248-nm lithography tools and produces tighter critical dimension control on all layers of circuits to improve results, said ASML and UMC.
semibiznews.com |
