try this line of thought...
K&S announces delays in shipping schedules for the 8028 ball bonder, which is a high speed, software driven ball bonder that attaches the chip to the package (substrate).
Cited reasons were space, chip, and substrate shortages. In other articles, we have seen that the foundries are now becoming quite selective as to what and who get processing priorities.
What this event suggests is that the chip shortages are real, and the newer designs may have problems getting into production. For Alliance, this may be just fine as they have been very careful about their product selections and are producing those things, which have reliable demand, (and yield). In fact, I would suggest that if the newer designs are having problems getting started, the product sales life of existing designs might be extended.
See…(thanks to dj beino)
eb-mag.com
The last conference call gave some indications of this quarter’s expectations, and I have to assume that consideration to the logistics to achieve their increased production has been taken into account and is currently in place.
The market seems to be excessively sensitive these days and is driven somewhat by the overly cautious (or maybe it is the gunslingers) . The market seems to be worried about an economic slow down yet we see mostly production constraints. I painfully conclude that we are still looking at opportunities. This will pass.
Pete |
