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Politics : Formerly About Applied Materials

AMAT 319.11

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3:59 PM EST

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To: pat mudge who wrote (36430)	8/9/2000 11:48:13 PM
From: Kirk ©	Read Replies (2) of 70976

Thanks for the most excellent notes! Here is a great tutorial on the Chip-Making process put out by "Infrastructure" infras.com I keep that link and other good ones here: pw2.netcom.com Note that the left hand side has all the process steps listed so you can click on one and go straight to the explanation. Infrastructure did a wonderful job with this. The 3 drivers for the industry are Copper, 300mm and smaller features. Copper will replace Aluminum in this slide infras.com 300mm is the diameter of the wafer (about 12" compared to today's 200mm or 8" wafers) 0.13um vs 0.18um means the distance between the source and drain in this slide infras.com Going from 0.18um to 0.13um allows you to put more transistors in a given area since you can make them smaller. So far, most orders are for smaller feature sizes and copper and 300mm are yet to come. AMAT said even with this, 72% of their orders are for the larger 0.18um equipment. (In college back in 1979, I built a 1mm x 1mm MOS transistor so these are REALLY SMALL!) Hope this helps. Thanks again for your notes. regards Kirk out

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