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Technology Stocks : Intel Corporation (INTC)
INTC 35.53-1.1%Nov 14 9:30 AM EST

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To: semiconeng who wrote (107574)8/16/2000 12:31:30 AM
From: Petz  Read Replies (2) of 186894
 
semiconeng, Dan's estimate of 20% waste space is not far from correct. For a 12mm by 10mm die, the absolute minimum waste space, if there is ZERO spacing between die it is possible to squeeze 236 die on the wafer, for a waste % of 9.9%.

If there's just a border of 0.2mm between each die, you can only fit 226 die, for a waste % of 13.7%. With 0.5 mm between die, you can fit 213 so wasted space is 18.6%.

There may be additional wasted space around the edges of a wafer which I did not take into account.

I made up a little spreadsheet to do this calculation, it was fun.

Petz
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