SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 246.76-0.5%Nov 14 9:30 AM EST
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Ali Chen who wrote (5436)8/17/2000 4:41:07 PM
From: Mani1Read Replies (3) of 275872
 
Ali,

Re <<This is incorrect and misleading, do not repeat paul's propaganda. >>

No it is correct, and it has nothing to do with what Paul says.

Coppermine consumes much less power than Athlon. Of course Athlon's are easier to provide the thermal management for because it can tolerate much higher die temp.

Re <<There were numerous reports of Coppermine overheating during continuous game play on Usenet groups. Just take a look a recent message about HP machines with side blower. >>

This says nothing about the absolute power consumption (or dissipation) of the chip. All it says is that the ridiculously low junction temp requirement for the Coppermine required more radical solution. I was shocked when I originally saw the 60 degree requirement of the original 1.0 GHz Coppermine. That is only 35 degrees above ambient. A clear sign of desperation by Intel.

Re <<Also look at recent development of all-copper-made heat sinks>>

I have not seen any "all copper" heat sink. That is got to be the dumbest thing I have ever heard. The actual bulk thermal conductivity of the fins does not need to be anything over 50 W/mK. Aluminum is around 185 and Copper is at 400. Making the fins out of Copper gives virtually no advantage and the added weight puts stress on the package. Copper only helps as the base heat spreader where minimum lateral thermal gradient is key. There is virtually no thermal gradient in the fins as the air convection is main thermal bottle neck at that point. Of course if you are liquid cooling the fins, then it is a different story.

Mani
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News