Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 246.76

-0.5%

Nov 14 9:30 AM EST

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To: Mani1 who wrote (5444)	8/17/2000 4:59:49 PM
From: Joe NYC	Read Replies (2) of 275872

Mani, The actual bulk thermal conductivity of the fins does not need to be anything over 50 W/mK. Aluminum is around 185 and Copper is at 400. Making the fins out of Copper gives virtually no advantage and the added weight puts stress on the package. I think the added weight not relevant compared to pressure needed by the clip attaching the heatsink to the CPU. (To satisfy AMD's spec for the termal solution) If you read some hardware newsgroups, it actually is a problem. There are very few Socket A heatsinks out there that satisfy AMD's requirements. There are some reports of people cracking their core while attaching the heatsink to the CPU. Basically, similar reports that we have heard about Intel's FC CPUs. I think AMD should hurry up and sell the Boxed versions of the CPU with the heatsink already attached to avoid these problems people will encounter in the DYO market. Joe

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