SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.14-0.8%Jan 9 3:59 PM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Joe NYC who wrote (5454)8/17/2000 5:09:30 PM
From: Mani1Read Replies (1) of 275872
 
Jozef re <<I think the added weight not relevant compared to pressure needed by the clip attaching the heatsink to the CPU. >>

The pressure from the spring is very different than a pound of metal being attached to the board. Every time a computer is turned around there is jerk to the package.

Re <<If you read some hardware newsgroups, it actually is a problem>>

What is?

Re <<There are very few Socket A heat sinks out there that satisfy AMD's requirements. >>

Yes, that is because of two reasons. One is the geometry of the sink required with the appropriate clip. And another one is that since AMD dissipates more power (the base of the original argument with Ali), there needs to be more fins. Making the fins out of Copper makes no advantage at all. All and all, TBirds are very easy to cool.

Mani
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext