Advanced Micro Devices - Moderated (AMD) Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 203.14

-0.8%

Jan 9 9:30 AM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: EricRR who wrote (6181)	8/22/2000 8:08:19 PM
From: Petz	Read Replies (1) of 275872

Eric, re:<Talking about hotspots!> Getta load of this spec for the P3 1.13 GHz, which I found perusing the latest Intel datasheet: CPU_Frequency maximum power density in watts per cm2 P3-800EB...32.6 P3-850.......35.2 P3-866.......35.9 P3-933.......39.9 P3-1000.....45.5 (old version) P3-1000.....40.9 P3-1133.....55.5 The spec sheet also makes clear that the P3-1133 may not have a junction temperature greater than 62degC, and that there is a 5.2 degC temperature rise from the case to the junction. This last number is also worse for the 1133 than for the 1000 by 1.4 degC. So the heat sink has to be able to dissipate 35.5 watts from an area 0.8 cm on a side, keeping the case of the P3-1133 at less than 56.8 degC inside a computer case where the ambient temperature is about 40 degC. Somehow I don't think we'll be seeing too many P3-1133 systems anytime soon. EDIT - a good question to ask is, Why is the active thermal area so much smaller for a P3-1133 than for a P3-1000 or anything else? Did they shrink the die that much and only get a 10% speed improvement? Petz

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next