Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 203.14

-0.8%

Jan 9 9:30 AM EST

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To: Petz who wrote (6195)	8/22/2000 10:17:20 PM
From: Mani1	Read Replies (1) of 275872

John re <<This last number is also worse for the 1133 than for the 1000 by 1.4 degC.>> As you get smaller die size, you increase the power density. Assuming an isothermal die, the thermal resistance from the die to the case is almost linearly proportional to the die size. Re <<So the heat sink has to be able to dissipate 35.5 watts from an area 0.8 cm on a side, keeping the case of the P3-1133 at less than 56.8 degC inside a computer case where the ambient temperature is about 40 degC.>> Yes, that is indeed difficult. A good heat spreader is a definite must since the die size is small. There only 17 degree C is available to dissipate 55 watts. Re <<Why is the active thermal area so much smaller for a P3-1133 than for a P3-1000 or anything else? Did they shrink the die that much and only get a 10% speed improvement?>> Yes, it is most likely just a die shrink. Mani

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