I'm not saying you don't make some of them, but the "reactive Ion Etchback" process that IBM described, is more commonly known as "Dry Etch". Dry Etch happens to be my area. If they are employing Dry Etch Techniques, to etch back the interconnect layer, then they are going to have lots of problems controlling the Etch Rates to insure that
they don't break trough the Poly Layer. I know all about the amount of intensive labor that it takes to maintain the type of dry etch rates that this type of process demands for logic circuits, I lived it for awhile. And believe me, it is neither easy, or cheap, or high yielding. Go talk to your dry etch process engineer, and see how much he/she likes your process.
You posted a link, which, although very dated, at least outlines how IBM processes this local interconnect level. I assume you read it. By your comments, it is clear you still don't have even a fundamental understanding of the actual described process flow and thus could never have actually run this process. I suggest you go back and read it again and understand it before you claim to know how easy, cheap, or high yielding the process is.
THE WATSONYOUTH |
