Dense-Pac's ``HELP-Stack'' Technology Stacks Up To Four DSP's
GARDEN GROVE, Calif., Aug 30, 2000 (BUSINESS WIRE) -- Dense-Pac Microsystems Inc. (Nasdaq: DPAC chart, msgs), a leading edge provider of high density semiconductor packaging solutions, Wednesday announced the introduction of its HELP-Stack(TM) technology designed to stack up to four Digital Signal Processors (DSPs) in the same space as one.
The programmable DSP market is estimated at $4.4 billion, which grew in excess of 27 percent last year as reported in Semiconductor Business News.
DSPs are specialized processors, designed specifically for applications requiring analysis and control of streams of data, such as in the rapidly growing telecommunications, audio, video, control and monitoring applications.
"In system performance, horse power is king," commented Ted Bruce, Dense-Pac's president and CEO. "You have a significant advantage if you can put more under the hood than your competitors. Dense-Pac's HELP-Stack(TM) allows DSP system designers to design in three-dimensions, resulting in solutions that can more than double the performance of their systems."
About Dense-Pac Microsystems Inc.
Dense-Pac Microsystems is a technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial, defense and aerospace customers to pack large amounts of memory into small spaces.
Its commercial products include applications such as network servers, computers storage devices and medical instrumentation. IDA can include airborne and space avionics and such diverse areas as space satellites and missiles and high performance servers. The company Web site is at www.dense-pac.com.
This news release includes forward-looking statements, including statements regarding the company's market, technology development, expansion and business plans, which are subject to change. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 29, 2000.
Contact:
Dense-Pac Microsystems, Garden Grove
Yvonne Huff, 714/898-0007
yvonneh@dense-pac.com
or
Wall Street Investor Relations Corp.
Joe Zappulla, 301/907-4090
JoeZ@WallStreetIR.com |
