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Technology Stocks : Qualcomm Incorporated (QCOM)
QCOM 148.83+1.1%Feb 4 3:59 PM EST

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To: S100 who wrote (84292)10/21/2000 1:07:28 PM
From: S100  Read Replies (1) of 152472
 
Photos of the QCP 2035 are at
gullfoss2.fcc.gov

The MSM is easy to spot but hard to read the label. It is a ball grid array, no pins out the sides. According to the QCOM CDMA handbook, the MSM3000 is available in a 176 pin TQFP (flat pack with pins out the sides) as well as a 196-ball PBGA (no pins out the sides). The newer MSMs seem to be available in PBGA only.
snip
(Pin-compatible with the MSM3000, the MSM5000 will be available in the same 176-ball Fine Pitched Grid Array (FBGA) package and 196-ball Plastic Ball grid Array (PBGA) production package. )
snip from qualcomm.com

After looking at a number of photos of Nokia Phones and QCP Phones, it seems that the construction of Nokia phones is much simpler. Few, if any RF shields, lots of small circuit packages. They may be much cheaper to build.

When searching the FCC site, use GML for Nokia, J9C for Qualcomm and OVF for Kyocera for the grantee code in the
Office of Engineering and Technology Generic Search Form.
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