Texas Instruments Announces Java(TM) Technology Support on TI DSP-based Open Multimedia Applications Platform (TM) for Next Generation Wireless Handsets
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biz.yahoo.com
DALLAS, Oct. 30 /PRNewswire/ -- In a move to bring higher performing, longer lasting mobile applications to the next generation of wireless Internet appliances, Texas Instruments (TI) Incorporated (NYSE: TXN - news) announced that Sun Microsystems' Java(TM) 2 Platform, Micro Edition (J2ME) will be ported onto TI's Open Multimedia Application Platform(TM). This effort expands the adoption of TI's high performance, ultra-low power OMAP architecture by providing Java software developers the ability to deliver Java technology- based wireless applications with up to three times the performance of competing solutions. See www.ti.com/sc/wireless.
``Communications-centric, 2.5 and 3G wireless applications will require mobile systems that deliver enhanced performance and battery life, while flexible enough for manufacturers and applications developers to support a wide range of wireless Internet appliances. TI's DSP-based OMAP platform, combined with Java technology, offers a compelling choice for applications developers in this space,'' said Gilles Delfassy, vice president, TI Worldwide Wireless Communications Unit. ``Sun's support of TI's OMAP architecture for 2.5 and 3G, is a tremendous endorsement for both the OMAP architecture and for the long-standing and successful relationship between the two companies.''
As part of the effort, OMAP developers and manufacturers will benefit from having J2ME support, tools, and APIs provide easy access to TI's DSP-based technology. Unveiled last year, TI's programmable DSP-based OMAP architecture delivers the high performance and power efficiency required for communications-centric 2.5 and 3G multimedia applications. The OMAP architecture supports all 2G, 2.5G and 3G wireless standards and is software code compatible with TI's DSP-based digital baseband, used today in more the 60 percent of today's digital wireless handsets. OMAP is fast becoming the de facto standard applications platform for 2.5 and 3G with public endorsements by Nokia, Ericsson, Sony and Handspring for their next generation wireless handsets and advanced mobile computing devices.
``The adoption of Java technology at all levels of the wireless industry is going to make it faster and easier to create and deploy interactive Java technology-enabled services, over the network to any mobile device,'' said Curtis Sasaki, director, Consumer Technologies, Sun Microsystems, Inc. ``By leveraging TI's OMAP architecture, Java technology developers will leverage the power and performance of TI's OMAP architecture to enhance the consumer experience with 3G applications.''
The industry defined J2ME and Mobile Information Device (MID) profile dramatically enhances the overall consumer experience by enabling dynamic, personalized interactive services for wireless devices. Created by more than twenty companies through the Java Community Process(TM) (JCP), the availability of the MID profile demonstrates how the wireless industry can collaborate to develop open, standards-based technologies that will enable practical and entertaining mobile interactive services.
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