>> TEXAS INSTRUMENTS AND MICROSOFT ANNOUNCE GSM/GPRS WIRELESS HANDSET SOLUTION OPTIMIZED FOR MICROSOFT'S SMART PHONE PLATFORM.
Nov. 8, 2000
PRNewswire
Collaboration, Utilizing TI's Open Multimedia Application Platform(TM) Technology, Enables Integrated Communication and Application Processing For GSM/GPRS Smart Phones
Texas Instruments Incorporated (NYSE: TXN) (TI) and Microsoft (Nasdaq: MSFT) today unveiled an integrated wireless solution designed to support next generation (2.5G), GSM/GPRS-enabled wireless handsets and advanced mobile computing devices. Based on Microsoft's smart phone platform (code-named Stinger) and TI's digital signal processor (DSP)-based GSM chipset technology, this solution will deliver broadband-enabled wireless applications to consumers, such as secure e-commerce, mobile Internet access and corporate e-mail, with greater performance and longer battery life.
TI's 2.5G smart phone solution integrates its power-efficient, programmable DSP-based digital baseband processor with its high-performance application processor to run Stinger-based applications. As future wireless data bandwidth increases from 2.5 to third generation communications (3G), this solution provides seamless compatibility with TI's future DSP-based Open Multimedia Applications Platform(TM) (OMAP(TM)) products. Compatibility with future OMAP architectures will provide original equipment manufacturers (OEMs) and applications developers with increasing levels of performance and battery efficiency, without having to constantly redesign existing software applications for new hardware architectures. TI's integrated baseband and applications processor will be complemented with its integrated analog, power management and radio frequency (RF) products.
"The next generation smart phones will harness new broadband wireless capabilities to enable a wealth of communications-centric, real-time multimedia applications," said Gilles Delfassy, vice president, TI's Wireless Terminals Business Unit. "By utilizing TI's high-performance, low power OMAP architecture, combined with Microsoft's software and applications expertise, consumers will enjoy new ways to stay connected. We are pleased to work with Microsoft to help enable their end-to-end wireless offering."
"This platform opens opportunities for new players to enter the market of next-generation smart phones," said Calvin Chih, vice president, Acer Communications and Multimedia Inc. "Because of the integration work Microsoft and TI have done, it will be faster and easier for manufacturers to deliver handsets to market."
"We are very excited to see this collaboration with TI come to fruition. Our combined efforts will result in a new generation of Microsoft 'Stinger' based smart phones with the end-to-end connectivity required to deliver enhanced communication, secure corporate access, entertainment and e-commerce services for the mobile user," said Ben Waldman, vice president, Microsoft Mobile Devices Division.
The Microsoft smart phone platform seeks to combine the best features of the personal digital assistant (PDA) with the best of the mobile phone, integrating voice capability and personal information management in a slim, stylish mobile phone. The TI integrated chipset is sampling today, with volume production in the 2H of 2001. <<
- Eric - |
