Taiwan's UMC to Leverage 300mm Wafers, 0.13-Micron Technology in 2001
November 29, 2000 (TAIPEI) -- "In 2001, we will concentrate on scaling up 300mm wafers and 0.13-micron technology," said Peter Chang, president of United Microelectronics Corp. of Taiwan.
Chang continued that the Si foundry will be an excellent business model in the coming decade, and expressed his company's objective in 2001 as launching technologies. First, UMC and Hitachi Ltd. will jointly proceed with test manufacturing of 300mm wafers beginning in January 2001 at their joint subsidiary, Trecenti Technologies Inc., and will bring production up to 7,000 sheets per month by the end of 2001.
It will introduce new manufacturing equipment for 300mm wafers in a plant currently under construction in Tainan by March 2001.
UMC plans to start mass production of 0.13-micron process technology some time in the third or the fourth quarter of 2001. The initial production will start at 4,000 to 5,000 units per month, and advance to production of high-end logic LSIs such as microprocessors, by incorporating Cu wiring technology and low-k material with low dielectric constant ranging from 2.7 to 2.5. Also, UMC plans to establish other technologies in 2001 such as 0.18-micron flash memory, and SiGe bi-CMOS technology.
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