Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 203.14

-0.8%

Jan 9 9:30 AM EST

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To: RDM who wrote (21368)	12/2/2000 4:00:36 PM
From: Mani1	Read Replies (1) of 275872

RDM re <<The thermal drop through the silicon wafer to the package is 60% of conventional silicon at 100 degrees C>> This is like saying voltage drop in resister A is 60% of that in resister B, without knowing anything about the two resisters. You simply can not make general comments like that. The thermal model and specific at the die varies not only on the heat output from the die, but also on the geometry of the die as well as the resistance of the entire thermal circuit all the way up to the fan and sink. Generally speaking, with a CPU dissipating up to 100 watts and with a current two fan & sink assembly, the wafer's bulk conductivity is not a thermal "bottle neck". Meaning a higher thermal conductivity wafer will offer little in that respect. But as the cooling solution become more advanced and die will become thinner, a higher conductivity die will offer more and more. Mani

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