Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 203.14

-0.8%

Jan 9 9:30 AM EST

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To: Mani1 who wrote (21370)	12/2/2000 4:31:58 PM
From: Daniel Schuh	Read Replies (4) of 275872

You got some expertise in this stuff, right Mani? I'm no expert myself, of course, but my understanding is that all thermal and cooling stuff is temperature gradient dependent. With current flip-chip packaging, the active area of the silicon is on the heat sink side of the package, right? So there's just not that much bulk material that the thermal energy has to go through in the first place? If you improve the thermal conductivity of the bulk silicon, I guess you would pass heat to the pin side of the package better, but what good does that do you? There might be some other material property benefits of going to isotopically pure silicon, but the straight thermal stuff still seems a little, er, optimistic to me. Cheers, Dan.

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