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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.14-0.8%Jan 9 9:30 AM EST
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To: Daniel Schuh who wrote (21373)12/2/2000 7:27:05 PM
From: Mani1Read Replies (1) of 275872
 
Dan re <<my understanding is that all thermal and cooling stuff is temperature gradient dependent.>>

Yes

Re <<With current flip-chip packaging, the active area of the silicon is on the heat sink side of the package, right? So there's just not that much bulk material that the thermal energy has to go through in the first place?>>

Don't think of the die as an isothermal 2D surface. Die has thickness and heat is generated in many of the layers. Also the die is not isothermal because heat is not uniformly generated throughout the die. Some parts of the die (active), generate a lot more heat than some other parts, so the die sometime acts a bit like a heat spreader.

Overall there can be a case made by the benefits of a higher thermal conductivity die, but saying the junction temperature decreases 30% (based on what temperature unit?) is just bunk. Thinking back, I remember looking at thermal models that showed only a few percent of an overall resistance of a 50W, 100mm^2 die, cooled using a dual fan heatsink/spreader combo, was in the die itself. So even if you eliminate that completely (sheer exaggeration) benefits will be no where near 30%.

Mani
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