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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 203.14-0.8%Jan 9 9:30 AM EST
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To: Mani1 who wrote (21377)12/2/2000 8:17:47 PM
From: GoutamRead Replies (1) of 275872
 
Mani,

<Don't think of the die as an isothermal 2D surface. Die has thickness and heat is generated in many of the layers. Also the die is not isothermal because heat is not uniformly generated throughout the die. Some parts of the die (active), generate a lot more heat than some other parts, so the die sometime acts a bit like a heat spreader.>

Mani, I understand what you are saying here. So when it comes to hot spots on the die, doesn't the new material(Si28)with its improved thernal conductivity make it a better heat spreader when compared to the conventional silicon?

goutama
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