Advanced Micro Devices - Moderated (AMD) Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 203.14

-0.8%

Jan 9 9:30 AM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Goutam who wrote (21379)	12/2/2000 8:32:40 PM
From: Mani1	Read Replies (2) of 275872

Goutam, Hi, Re <<So when it comes to hot spots on the die, doesn't the new material(Si28)with its improved thernal conductivity make it a better heat spreader when compared to the conventional silicon?>> Yes, and that is the point I was making. But considering that wafer is already a good heat spreader, not a lot can be accomplished by making it even better. Think of it as a 100 ohms and 5 ohm resisters in series. Even if you cut down the 5 ohm resister by 2/3, the over all resistance will be little (<4%) changed. In this case the 5 ohms resister is the die and the 100 ohm is the fan and heat sink. I think the 100 to 5 ratio is pretty close to the actual case for a 50 watt, 100mm^2 die cooled with a standard extruded aluminum, dual fan set up. Mani

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next