Advanced Micro Devices - Moderated (AMD) Message Board

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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 259.65

+2.3%

Jan 23 3:59 PM EST

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To: Ali Chen who wrote (21416)	12/3/2000 10:56:08 PM
From: Bill Jackson	Read Replies (3) of 275872

Ali, I think the chip might have more than 25% of the thermal resistance across it. Remember the heat sinks have to be very flat as is the die surface so the heat sinc coumpound is very thinly spread and they use better stuff that titanium dioxide(white stuff) such as silver powders. In addition the heat sink is very well cooled by higher air flows with enough velocity to trim the boundary layer down as this as possible. It seems reasonable to expect that 30% they tout....in an optimised system of course. recall the heat flow equation is a series flow analagous to series resistors, if they make all the other resistances as small as possible then the lions share of gradient lies across the substrate. Then there is the heat taken off the front by the bumps into the pins. Do they make any efforts to make the socket a heat sink? this is doable. Voltages are low so a copper or aluminum plate in the socket would take away some heat. You would need holes in it and insulation with a fine pitch etc, but doable....every little bit helps. Bill

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