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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 248.73

+7.2%

3:32 PM EST

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To: Mani1 who wrote (21380)	12/3/2000 11:14:00 PM
From: Bill Jackson	Read Replies (1) of 275872

Mani, I think there is more resistance to heat flow in the Si substrate than the 5% you mention. Remember the Al heat sink spreads out in all directions and the newer compounds are better thermal tranmitters across the gap and the new specs calls for the heat sink to be extremely flat and rigid and do not some people use a copper spreader in contact with the die? Bill

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