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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 259.65+2.3%Jan 23 9:30 AM EST

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To: Bill Jackson who wrote (21419)12/3/2000 11:48:48 PM
From: Ali ChenRead Replies (1) of 275872
 
Bill, <I think the chip might have more than 25% of the thermal resistance across it.>

Pete just showed us with numbers that realistically
it is around 25%.

<heat sinks have to be very flat as is the die surface>

It is just another resistor in your model:
<recall the heat flow equation is a series flow analagous to series resistors>

<if they make all the other resistances as small as possible then the lions share of gradient lies across the substrate.>

This is a _VERY_ big IF. The other resistances are
already as small as economically possible.

<Do they make any efforts to make the socket a heat sink?>
Some do (using alumina ceramic packages),
some not (using cheap plastic).

<You would need holes in it and insulation with a fine pitch etc, but doable....>

Some estimations of cost would be helpful here.
I've heard that the crystalline carbon-12 is a very
good heat conductor too :)

Sorry for goofing around, Bill:)
Best regards,
- Ali
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