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Technology Stocks : Advanced Micro Devices - Moderated (AMD)

AMD 259.65

+2.3%

Jan 23 3:59 PM EST

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To: Bill Jackson who wrote (21424)	12/5/2000 10:25:10 AM
From: fyodor_	Read Replies (1) of 275872

Bill: Note the spec calls for very well machined flats on the heat sinks....not the extruded near flats of the 486 et al. I think we need to re-educate ourselves about the best of todays fan aided heat sinks plus the new isotopically pure Si 28. A major difference is also the amount of pressure applied to the heat sink. Those 486 heat sinks were almost just stuck on there (and, usually, thermal paste wasn't even used - which is really, really dumb in that hs+paste is better than hs+fan, and a heck of a lot cheaper). I was seriously shocked at the amount of pressure I needed to apply to get the heatsink on my 700MHz (slot) Athlon and my understanding is that the new socket chips from both AMD and Intel call for even greater pressure (and now they have these rubber pads to decrease the risk of cracking/chipping the chip). -fyo

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